Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11080455 | Layout design of integrated circuit with through-substrate via | Chih-Chia Hu, Ming-Fa Chen, Sen-Bor Jan | 2021-08-03 |
MC
Meng-Wei Chiang
Overall (2021): #338,000 of 548,734Top 65%
1
Patents 2021