Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107779 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen, Chih-Chia Hu | 2021-08-31 |
| 11094613 | Semiconductor structure and manufacturing method thereof | Chih-Chia Hu, Hsien-Wei Chen, Ming-Fa Chen | 2021-08-17 |
| 11080455 | Layout design of integrated circuit with through-substrate via | Chih-Chia Hu, Ming-Fa Chen, Meng-Wei Chiang | 2021-08-03 |
| 10949597 | Through-silicon vias in integrated circuit packaging | Fong-Yuan Chang, Chin-Chou Liu, Chin-Her Chien, Cheng-Hung Yeh, Po-Hsiang Huang +2 more | 2021-03-16 |
| 10930580 | Semiconductor device and method of manufacture | Chih-Chia Hu, Hsien-Wei Chen, Ming-Fa Chen | 2021-02-23 |