Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211333 | Through silicon via optimization for three-dimensional integrated circuits | Fong-Yuan Chang, Chin-Chou Liu, Po-Hsiang Huang, Noor Mohamed Ettuveettil | 2021-12-28 |
| 11094608 | Heat dissipation structure including stacked chips surrounded by thermal interface material rings | Po-Hsiang Huang, Chin-Chou Liu, Fong-Yuan Chang, Hui Yu Lee | 2021-08-17 |
| 11075116 | Integrated antenna on interposer substrate | Bo-Jr Huang, William Wu Shen, Chin-Chou Liu, Yun-Han Lee | 2021-07-27 |
| 10949597 | Through-silicon vias in integrated circuit packaging | Fong-Yuan Chang, Chin-Chou Liu, Cheng-Hung Yeh, Po-Hsiang Huang, Sen-Bor Jan +2 more | 2021-03-16 |