Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11170150 | Method for making a semiconductor device | Chi-Wen Chang, Ya Yun Liu, Jui-Feng Kuan, Yi-Kan Cheng | 2021-11-09 |
| 11094608 | Heat dissipation structure including stacked chips surrounded by thermal interface material rings | Po-Hsiang Huang, Chin-Chou Liu, Chin-Her Chien, Fong-Yuan Chang | 2021-08-17 |
| 11088084 | Electromagnetic shielding metal-insulator-metal capacitor structure | Chin-Chou Liu, Cheng-Hung Yeh, Fong-Yuan Chang, Po-Hsiang Huang, Yi-Kan Cheng +1 more | 2021-08-10 |
| 11043473 | Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same | Chih-Lin Chen, Chin-Chou Liu, Fong-Yuan Chang, Po-Hsiang Huang | 2021-06-22 |
| 10971485 | Solenoid inductors within a multi-chip package | Ka Fai Chang | 2021-04-06 |
| 10943729 | Entangled inductor structures | Ka Fai Chang, Chin-Chou Liu, Fong-Yuan Chang, Yi-Kan Cheng | 2021-03-09 |
| 10910365 | Structure and method for cooling three-dimensional integrated circuits | Chi-Wen Chang, Jui-Feng Kuan, Yi-Kan Cheng | 2021-02-02 |