Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11182533 | Standard cells and variations thereof within a standard cell library | Sheng-Hsiung Chen, Jerry Chang Jui Kao, Fong-Yuan Chang, Po-Hsiang Huang, Shao-Huan Wang +2 more | 2021-11-23 |
| 11170150 | Method for making a semiconductor device | Chi-Wen Chang, Hui Yu Lee, Ya Yun Liu, Jui-Feng Kuan | 2021-11-09 |
| 11157677 | Merged pillar structures and method of generating layout diagram of same | Hiranmay Biswas, Chung-Hsing Wang, Kuo-Nan Yang | 2021-10-26 |
| 11138360 | Semiconductor device with filler cell region, method of generating layout diagram and system for same | Po-Hsiang Huang, Chin-Chou Liu, Sheng-Hsiung Chen, Fong-Yuan Chang, Hui-Zhong Zhuang +2 more | 2021-10-05 |
| 11088084 | Electromagnetic shielding metal-insulator-metal capacitor structure | Hui Yu Lee, Chin-Chou Liu, Cheng-Hung Yeh, Fong-Yuan Chang, Po-Hsiang Huang +1 more | 2021-08-10 |
| 11030372 | Method for generating layout diagram including cell having pin patterns and semiconductor device based on same | Pin-Dai Sue, Chin-Chou Liu, Sheng-Hsiung Chen, Fong-Yuan Chang, Lee-Chung Lu +4 more | 2021-06-08 |
| 10949597 | Through-silicon vias in integrated circuit packaging | Fong-Yuan Chang, Chin-Chou Liu, Chin-Her Chien, Cheng-Hung Yeh, Po-Hsiang Huang +2 more | 2021-03-16 |
| 10943729 | Entangled inductor structures | Ka Fai Chang, Chin-Chou Liu, Fong-Yuan Chang, Hui Yu Lee | 2021-03-09 |
| 10910365 | Structure and method for cooling three-dimensional integrated circuits | Hui Yu Lee, Chi-Wen Chang, Jui-Feng Kuan | 2021-02-02 |