Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088084 | Electromagnetic shielding metal-insulator-metal capacitor structure | Hui Yu Lee, Chin-Chou Liu, Cheng-Hung Yeh, Fong-Yuan Chang, Po-Hsiang Huang +1 more | 2021-08-10 |
| 11018080 | Semiconductor package and method of forming the same | Roshan Weerasekera, Surya Bhattacharya, Vempati Srinivasa Rao | 2021-05-25 |
| 10971485 | Solenoid inductors within a multi-chip package | Hui Yu Lee | 2021-04-06 |
| 10943729 | Entangled inductor structures | Chin-Chou Liu, Fong-Yuan Chang, Hui Yu Lee, Yi-Kan Cheng | 2021-03-09 |