Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018080 | Semiconductor package and method of forming the same | Roshan Weerasekera, Ka Fai Chang, Vempati Srinivasa Rao | 2021-05-25 |
| 10989887 | Photonic integrated circuit package and method of forming the same | Teck Guan Lim | 2021-04-27 |