Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177318 | Semiconductor package and method of forming the same | Hideaki Fukuzawa, Hang Yip Liu | 2021-11-16 |
| 11105989 | Optical assembly and method of forming the same | — | 2021-08-31 |
| 10989887 | Photonic integrated circuit package and method of forming the same | Surya Bhattacharya | 2021-04-27 |