Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088084 | Electromagnetic shielding metal-insulator-metal capacitor structure | Hui Yu Lee, Chin-Chou Liu, Fong-Yuan Chang, Po-Hsiang Huang, Yi-Kan Cheng +1 more | 2021-08-10 |
| 10949597 | Through-silicon vias in integrated circuit packaging | Fong-Yuan Chang, Chin-Chou Liu, Chin-Her Chien, Po-Hsiang Huang, Sen-Bor Jan +2 more | 2021-03-16 |