Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11182528 | Electromigration sign-off tool | Yu-Tseng Hsien, Chin-Shen Lin, Ching-Shun Yang | 2021-11-23 |
| 11170150 | Method for making a semiconductor device | Chi-Wen Chang, Hui Yu Lee, Ya Yun Liu, Yi-Kan Cheng | 2021-11-09 |
| 10943052 | Integrated circuit design method, system and computer program product | Chi-Wen Chang | 2021-03-09 |
| 10910365 | Structure and method for cooling three-dimensional integrated circuits | Hui Yu Lee, Chi-Wen Chang, Yi-Kan Cheng | 2021-02-02 |