Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11075136 | Heat transfer structures and methods for IC packages | Ying-Chih Hsu, Alan Roth, Chuei-Tang Wang, Chih-Yuan Chang, Eric Soenen | 2021-07-27 |
| 11043473 | Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same | Chin-Chou Liu, Fong-Yuan Chang, Hui Yu Lee, Po-Hsiang Huang | 2021-06-22 |