Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11095333 | Systems and methods for die-to-die communication | Huan-Neng Chen, Chewn-Pu Jou, Feng-Wei Kuo, Lan-Chou Cho | 2021-08-17 |
| 11075116 | Integrated antenna on interposer substrate | Bo-Jr Huang, Chin-Her Chien, Chin-Chou Liu, Yun-Han Lee | 2021-07-27 |
| 10938443 | Communication system and method of data communications | Feng-Wei Kuo, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho | 2021-03-02 |
| 10930603 | Coaxial through via with novel high isolation cross coupling method for 3D integrated circuits | Feng-Wei Kuo, Wen-Shiang Liao, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho | 2021-02-23 |