Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11119280 | Grating couplers and methods of making same | Feng-Wei Kuo, Lan-Chou Cho, Huan-Neng Chen, Chewn-Pu Jou | 2021-09-14 |
| 11114745 | Antenna package for signal transmission | Feng-Wei Kuo | 2021-09-07 |
| 11062988 | 3D IC decoupling capacitor structure and method for manufacturing the same | Chewn-Pu Jou | 2021-07-13 |
| 11024979 | 3D IC antenna array with laminated high-k dielectric | Feng-Wei Kuo | 2021-06-01 |
| 11018215 | Package and manufacturing method thereof | Chih-Hang Tung | 2021-05-25 |
| 10930603 | Coaxial through via with novel high isolation cross coupling method for 3D integrated circuits | Feng-Wei Kuo, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho, William Wu Shen | 2021-02-23 |
| 10923417 | Integrated fan-out package with 3D magnetic core inductor | Chih-Hang Tung, Chen-Hua Yu, Chewn-Pu Jou, Feng-Wei Kuo | 2021-02-16 |