Issued Patents 2021
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177810 | All-digital phase locked loop using switched capacitor voltage doubler | Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho, Robert Bogdan Staszewski, Seyednaser Pourmousavian | 2021-11-16 |
| 11119280 | Grating couplers and methods of making same | Lan-Chou Cho, Huan-Neng Chen, Chewn-Pu Jou, Wen-Shiang Liao | 2021-09-14 |
| 11114745 | Antenna package for signal transmission | Wen-Shiang Liao | 2021-09-07 |
| 11095333 | Systems and methods for die-to-die communication | Huan-Neng Chen, Chewn-Pu Jou, Lan-Chou Cho, William Wu Shen | 2021-08-17 |
| 11023647 | Integrated circuit stack verification method and system for performing the same | Shuo-Mao Chen, Chin-Yuan Huang, Kai-Yun Lin, Ho-Hsiang Chen, Chewn-Pu Jou | 2021-06-01 |
| 11024979 | 3D IC antenna array with laminated high-k dielectric | Wen-Shiang Liao | 2021-06-01 |
| 11002915 | Fiber-to-chip grating coupler for photonic circuits | Lan-Chou Cho, Huan-Neng Chen, Chewn-Pu Jou | 2021-05-11 |
| 10985709 | Systems and methods for suppressing and mitigating harmonic distortion in a circuit | Kai Xu, Robert Bogdan Staszewski | 2021-04-20 |
| 10976489 | Optical device and method of manufacturing the same | Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho | 2021-04-13 |
| 10938443 | Communication system and method of data communications | William Wu Shen, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho | 2021-03-02 |
| 10930603 | Coaxial through via with novel high isolation cross coupling method for 3D integrated circuits | Wen-Shiang Liao, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho, William Wu Shen | 2021-02-23 |
| 10923417 | Integrated fan-out package with 3D magnetic core inductor | Wen-Shiang Liao, Chih-Hang Tung, Chen-Hua Yu, Chewn-Pu Jou | 2021-02-16 |