Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107779 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen, Sen-Bor Jan | 2021-08-31 |
| 11094613 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen, Sen-Bor Jan | 2021-08-17 |
| 11088041 | Semiconductor packages with shortened talking path | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2021-08-10 |
| 11080455 | Layout design of integrated circuit with through-substrate via | Ming-Fa Chen, Sen-Bor Jan, Meng-Wei Chiang | 2021-08-03 |
| 11031354 | Mixing organic materials into hybrid packages | Ming-Fa Chen, Hsien-Wei Chen, Chen-Hua Yu | 2021-06-08 |
| 10996558 | Multiple-mask multiple-exposure lithography and masks | Peter Yu, Chih-Tung Hsu, Kevin Wang, Roger Chen | 2021-05-04 |
| 10937743 | Mixing organic materials into hybrid packages | Ming-Fa Chen, Hsien-Wei Chen, Chen-Hua Yu | 2021-03-02 |
| 10930580 | Semiconductor device and method of manufacture | Sen-Bor Jan, Hsien-Wei Chen, Ming-Fa Chen | 2021-02-23 |