Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121084 | Integrated circuit device with through interconnect via and methods of manufacturing the same | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2021-09-14 |
| 10998293 | Method of fabricating semiconductor structure | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2021-05-04 |
| 10985121 | Bump structure and fabricating method thereof | Chang-Pin Huang, Tung-Liang Shao, Hsien-Ming Tu, Yu-Chia Lai | 2021-04-20 |