Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107772 | Semiconductor package and method of manufacturing semiconductor package | Tsung-Hsien Chiang, Hao-Yi Tsai, Tin-Hao Kuo | 2021-08-31 |
| 10985121 | Bump structure and fabricating method thereof | Chang-Pin Huang, Tung-Liang Shao, Ching-Jung Yang, Yu-Chia Lai | 2021-04-20 |