Issued Patents 2021
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004826 | 3DIC formation with dies bonded to formed RDLs | Chen-Hua Yu, Sung-Feng Yeh | 2021-05-11 |
| 10998293 | Method of fabricating semiconductor structure | Hsien-Wei Chen, Jie Chen, Ching-Jung Yang | 2021-05-04 |
| 10978410 | Semiconductor structure and manufacturing method thereof | Tzuan-Horng Liu, Hsien-Wei Chen | 2021-04-13 |
| 10971417 | 3D stacked-chip package | Chen-Hua Yu, Wen-Sen Lu, Wen-Chih Chiou, Wen-Ching Tsai | 2021-04-06 |
| 10971443 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu, Sung-Feng Yeh, Hsien-Wei Chen | 2021-04-06 |
| 10957610 | Integrated circuit component and package structure having the same | Tzuan-Horng Liu, Chao-Hsiang Yang, Hsien-Wei Chen | 2021-03-23 |
| 10950576 | Package structure | Tzuan-Horng Liu, Hsien-Wei Chen, Jiun-Heng Wang | 2021-03-16 |
| 10950579 | Integrated circuit package and method of forming same | Hsien-Wei Chen, Chen-Hua Yu | 2021-03-16 |
| 10937743 | Mixing organic materials into hybrid packages | Hsien-Wei Chen, Chih-Chia Hu, Chen-Hua Yu | 2021-03-02 |
| 10930633 | Buffer design for package integration | Jie Chen, Hsien-Wei Chen, Chen-Hua Yu | 2021-02-23 |
| 10930580 | Semiconductor device and method of manufacture | Chih-Chia Hu, Sen-Bor Jan, Hsien-Wei Chen | 2021-02-23 |
| 10923421 | Package structure and method of manufacturing the same | Ying-Ju Chen, Hsien-Wei Chen | 2021-02-16 |
| 10923431 | Method for forming a 3D IC architecture including forming a first die on a first side of a first interconnect structure and a second die in an opening formed in a second side | Hsien-Pin Hu, Chen-Hua Yu, Jing-Cheng Lin, Jiun-Ren Lai, Yung-Chi Lin | 2021-02-16 |
| 10886245 | Semiconductor structure, 3DIC structure and method of fabricating the same | Hsien-Wei Chen, Jie Chen, Sung-Feng Yeh | 2021-01-05 |