Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145623 | Integrated circuit packages and methods of forming the same | Chia-Hao Hsu, Wen-Chih Chiou | 2021-10-12 |
| 11101240 | Isolation bonding film for semiconductor packages and methods of forming the same | Ming-Tsu Chung, Ku-Feng Yang, Wen-Chih Chiou, Chen-Hua Yu | 2021-08-24 |
| 11063008 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Tsang-Jiuh Wu, Wen-Chih Chiou | 2021-07-13 |
| 11056419 | Semiconductor device having backside interconnect structure on through substrate via and method of forming the same | Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih, Chia-Yin Chen +3 more | 2021-07-06 |
| 10923431 | Method for forming a 3D IC architecture including forming a first die on a first side of a first interconnect structure and a second die in an opening formed in a second side | Hsien-Pin Hu, Chen-Hua Yu, Ming-Fa Chen, Jing-Cheng Lin, Jiun-Ren Lai | 2021-02-16 |