Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101240 | Isolation bonding film for semiconductor packages and methods of forming the same | Ming-Tsu Chung, Yung-Chi Lin, Wen-Chih Chiou, Chen-Hua Yu | 2021-08-24 |
| 11056419 | Semiconductor device having backside interconnect structure on through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2021-07-06 |
| 11004741 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Hong-Ye Shih, Tsang-Jiuh Wu +3 more | 2021-05-11 |