Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11063008 | Semiconductor structure and manufacturing method thereof | Yung-Chi Lin, Chen-Hua Yu, Wen-Chih Chiou | 2021-07-13 |
| 11056419 | Semiconductor device having backside interconnect structure on through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2021-07-06 |
| 11037904 | Singulation and bonding methods and structures formed thereby | Chen-Hua Yu, Wen-Chih Chiou | 2021-06-15 |
| 11004741 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Hong-Ye Shih, Ku-Feng Yang +3 more | 2021-05-11 |