Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10971417 | 3D stacked-chip package | Chen-Hua Yu, Ming-Fa Chen, Wen-Sen Lu, Wen-Chih Chiou | 2021-04-06 |
WT
Wen-Ching Tsai
Overall (2021): #214,701 of 548,734Top 40%
1
Patents 2021