Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10971417 | 3D stacked-chip package | Chen-Hua Yu, Ming-Fa Chen, Wen-Chih Chiou, Wen-Ching Tsai | 2021-04-06 |
WL
Wen-Sen Lu
Overall (2021): #215,183 of 548,734Top 40%
1
Patents 2021