Issued Patents 2021
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189599 | System formed through package-in-package formation | Chen-Hua Yu, Ming-Fa Chen | 2021-11-30 |
| 11164848 | Semiconductor structure and method manufacturing the same | Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Tzuan-Horng Liu, Chuan-An Cheng | 2021-11-02 |
| 11114413 | Stacking structure, package structure and method of fabricating the same | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih | 2021-09-07 |
| 11069608 | Semiconductor structure and manufacturing method thereof | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih | 2021-07-20 |
| 11069658 | System on integrated chips and methods of forming same | Chen-Hua Yu, Ming-Fa Chen | 2021-07-20 |
| 11063019 | Package structure, chip structure and method of fabricating the same | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih | 2021-07-13 |
| 11063022 | Package and manufacturing method of reconstructed wafer | Ming-Fa Chen, Chao-Wen Shih, Hsien-Wei Chen, Tzuan-Horng Liu | 2021-07-13 |
| 11056438 | Semiconductor packages and method of forming the same | Ming-Fa Chen, Nien-Fang Wu, Tzuan-Horng Liu, Chao-Wen Shih | 2021-07-06 |
| 11043482 | Semiconductor component, package structure and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen, Chi-Hwang Tai | 2021-06-22 |
| 11024605 | Integrated circuit package and method | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih, Nien-Fang Wu | 2021-06-01 |
| 11004826 | 3DIC formation with dies bonded to formed RDLs | Chen-Hua Yu, Ming-Fa Chen | 2021-05-11 |
| 10971443 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen | 2021-04-06 |
| 10886245 | Semiconductor structure, 3DIC structure and method of fabricating the same | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2021-01-05 |