Issued Patents 2021
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10957582 | Self aligned via and pillar cut for at least a self aligned double pitch | Benjamin D. Briggs, Lawrence A. Clevenger, Terry A. Spooner, Theodorus E. Standaert | 2021-03-23 |
| 10957850 | Multi-layer encapsulation to enable endpoint-based process control for embedded memory fabrication | Ashim Dutta, Isabel Cristina Chu, Son V. Nguyen, John C. Arnold | 2021-03-23 |
| 10957646 | Hybrid BEOL metallization utilizing selective reflection mask | Benjamin D. Briggs, Cornelius Brown Peethala, Koichi Motoyama, Gen Tsutsui, Ruqiang Bao +2 more | 2021-03-23 |
| 10957622 | Spatially localized thermal interface materials | Jonathan Fry, Tuhin Sinha | 2021-03-23 |
| 10950662 | Resistive memory device with meshed electrodes | Takashi Ando, Lawrence A. Clevenger, Chih-Chao Yang | 2021-03-16 |
| 10943866 | Method and structure to construct cylindrical interconnects to reduce resistance | Benjamin D. Briggs, Christopher J. Penny, Huai Huang, Lawrence A. Clevenger, Hosadurga Shobha | 2021-03-09 |
| 10915620 | Paint on micro chip touch screens | Maryam Ashoori, Benjamin D. Briggs, Justin A. Canaperi, Lawrence A. Clevenger, Leigh Anne H. Clevenger +1 more | 2021-02-09 |
| 10916501 | Back end of line electrical fuse structure and method of fabrication | Benjamin D. Briggs, Lawrence A. Clevenger, Chih-Chao Yang | 2021-02-09 |
| 10912986 | Dynamic rigidity mechanism | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo | 2021-02-09 |
| 10901030 | Viscoelastic pad upon integrated circuit device contact for multipass electrical characterization probe testing | Max S. Cioban, Jonathan Fry, Tuhin Sinha | 2021-01-26 |
| 10903184 | Filler particle position and density manipulation with applications in thermal interface materials | Jonathan Fry, Tuhin Sinha, Bassem M. Hamieh | 2021-01-26 |
| 10903162 | Fuse element resistance enhancement by laser anneal and ion implantation | Liying Jiang, Juntao Li, Chih-Chao Yang, Yi Song | 2021-01-26 |
| 10901317 | Extreme ultraviolet (EUV) lithography patterning methods utilizing EUV resist hardening | Benjamin D. Briggs, Ekmini Anuja De Silva, Chih-Chao Yang, Lawrence A. Clevenger | 2021-01-26 |
| 10892404 | Sacrificial buffer layer for metal removal at a bevel edge of a substrate | Ashim Dutta, Saba Zare, Theodorus E. Standaert, Daniel C. Edelstein | 2021-01-12 |