HA

Hari Prasad Amanapu

IBM: 7 patents #710 of 11,638Top 7%
Overall (2021): #17,285 of 548,734Top 4%
7
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
11127825 Middle-of-line contacts with varying contact area providing reduced contact resistance Chanro Park, Kangguo Cheng, Ruilong Xie 2021-09-21
11037795 Planarization of dielectric topography and stopping in dielectric Cornelius Brown Peethala, Iqbal Rashid Saraf, Raghuveer R. Patlolla, Chih-Chao Yang 2021-06-15
11037875 Forming dual metallization interconnect structures in single metallization level Charan V. Surisetty, Raghuveer R. Patlolla 2021-06-15
11031337 Forming dual metallization interconnect structures in single metallization level Charan V. Surisetty, Raghuveer R. Patlolla 2021-06-08
11024720 Non-self aligned contact semiconductor devices Ruilong Xie, Kangguo Cheng, Chanro Park 2021-06-01
10978388 Skip via for metal interconnects Prasad Bhosale, Nicholas V. LiCausi, Lars Liebmann, James Jay McMahon, Cornelius Brown Peethala +1 more 2021-04-13
10916431 Robust gate cap for protecting a gate from downstream metallization etch operations Raghuveer R. Patlolla, Vimal Kamineni, Sugirtha Krishnamurthy, Viraj Y. Sardesai, Cornelius Brown Peethala 2021-02-09