Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037875 | Forming dual metallization interconnect structures in single metallization level | Hari Prasad Amanapu, Raghuveer R. Patlolla | 2021-06-15 |
| 11038055 | Method and structure of improving contact resistance for passive and long channel devices | Injo Ok, Soon-Cheon Seo, Balasubramanian Pranatharthiharan | 2021-06-15 |
| 11031337 | Forming dual metallization interconnect structures in single metallization level | Hari Prasad Amanapu, Raghuveer R. Patlolla | 2021-06-08 |
| 11011429 | Minimize middle-of-line contact line shorts | Injo Ok, Balasubramanian Pranatharthiharan, Soon-Cheon Seo | 2021-05-18 |
| 10896816 | Silicon residue removal in nanosheet transistors | Zhenxing Bi, Thamarai S. Devarajan, Nicolas Loubet, Binglin Miao, Muthumanickam Sankarapandian +2 more | 2021-01-19 |