Issued Patents 2021
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211283 | Method for forming a bulk semiconductor substrate configured to exhibit soi behavior | Gulbagh Singh, Kun-Tsang Chuang | 2021-12-28 |
| 11189743 | Single photon avalanche diode | Chia-Yu Wei, Yu-Ting Kao, Yen-Liang Lin, Wen-I Hsu, Hsun-Ying Huang +1 more | 2021-11-30 |
| 11183523 | CMOS image sensor having indented photodiode structure | Chia-Yu Wei, Kuo-Cheng Lee, Ping-Hao Lin, Hsun-Ying Huang, Yen-Liang Lin +1 more | 2021-11-23 |
| 11172142 | Image sensor for sensing LED light with reduced flickering | Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee | 2021-11-09 |
| 11152417 | Anchor structures and methods for uniform wafer planarization and bonding | Chia-Yu Wei, Cheng-Yuan Li, Kuo-Cheng Lee, Hsun-Ying Huang, Yen-Liang Lin | 2021-10-19 |
| 11145539 | Shallow trench isolation for integrated circuits | Gulbagh Singh, Kun-Tsang Chuang | 2021-10-12 |
| 11140309 | Image sensor including light shielding layer and patterned dielectric layer | Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee, Hsun-Ying Huang | 2021-10-05 |
| 11121141 | Semiconductor structure and method for forming the same | Chiang-Ming Chuang, Chien-Hsuan Liu, Chih-Ming Lee, Kun-Tsang Chuang, Hung-Che Liao | 2021-09-14 |
| 11018179 | Semiconductor structure | Chia-Yu Wei, Chin-Hsun Hsiao, Yi-Hsing Chu, Yen-Liang Lin, Yung-Lung Hsu | 2021-05-25 |
| 11011566 | Bonding pad on a back side illuminated image sensor | Volume Chien, I-Chih Chen, Hung-Ta Huang, Ying-Hao Chen, Ying-Lang Wang | 2021-05-18 |
| 10943942 | Image sensor device and method of forming the same | Chia-Yu Wei, Yen-Liang Lin, Kuo-Cheng Lee, Hsun-Ying Huang | 2021-03-09 |