Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211289 | Metal loss prevention using implantation | Li-Chieh Wu, Tang-Kuei Chang, Kuo-Hsiu Wei, Kei-Wei Chen, Su-Hao Liu +5 more | 2021-12-28 |
| 11183631 | Electrode structure to improve RRAM performance | Wen-Ting Chu, Tong-Chern Ong | 2021-11-23 |
| 11018176 | Metal shielding layer in backside illumination image sensor chips and methods for forming the same | Shih-Chieh Chang, Jian-Shin Tsai, Chih-Chang Huang, Ing-Ju Lee, Ching-Yao Sun +3 more | 2021-05-25 |
| 11011566 | Bonding pad on a back side illuminated image sensor | Volume Chien, I-Chih Chen, Hsin-Chi Chen, Hung-Ta Huang, Ying-Hao Chen | 2021-05-18 |
| 10916481 | Thickness sensor for conductive features | Chih-Hung Chen, Kei-Wei Chen | 2021-02-09 |