Issued Patents 2021
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211289 | Metal loss prevention using implantation | Li-Chieh Wu, Tang-Kuei Chang, Kuo-Hsiu Wei, Ying-Lang Wang, Su-Hao Liu +5 more | 2021-12-28 |
| 11195931 | Gate structure, semiconductor device and the method of forming semiconductor device | Chun Hsiung Tsai, Kuo-Feng Yu, Chien-Tai Chan, Ziwei Fang, Huai-Tei Yang | 2021-12-07 |
| 11171209 | Semiconductor device and method of manufacture | Heng-Wen Ting, Chii-Horng Li, Pei-Ren Jeng, Hsueh-Chang Sung, Yen-Ru Lee +1 more | 2021-11-09 |
| 11145751 | Semiconductor structure with doped contact plug and method for forming the same | Kuo-Ju Chen, Su-Hao Liu, Chun-Hao Kung, Liang-Yin Chen, Huicheng Chang +6 more | 2021-10-12 |
| 11139432 | Methods of forming a FinFET device | Chang-Miao Liu, Bwo-Ning Chen | 2021-10-05 |
| 11133247 | Vias with metal caps for underlying conductive lines | Chia-Wei Ho, Chun-Wei Hsu, Chi-Hsiang Shen, Chi-Jen Liu, Yi-Sheng Lin +3 more | 2021-09-28 |
| 11117239 | Chemical mechanical polishing composition and method | Shich-Chang Suen, Liang-Guang Chen | 2021-09-14 |
| 11094555 | CMP slurry and CMP method | Chun-Wei Hsu, Chi-Jen Liu, Liang-Guang Chen, William Weilun Hong, Chi-Hsiang Shen +2 more | 2021-08-17 |
| 11094797 | Semiconductor structure having a source/drain stressor including a plurality of silicon-containing layers | Chun Hsiung Tsai | 2021-08-17 |
| 11087987 | Semiconductor device and method | Ta-Chun Ma, Yi-Cheng Li, Pin-Ju Liang, Cheng-Po Chau, Jung-Jen Chen +3 more | 2021-08-10 |
| 11069533 | CMP system and method of use | Te-Chien Hou, Yu-Ting Yen, Cheng-Yu Kuo, Chih-Hung Chen, William Weilun Hong | 2021-07-20 |
| 11056352 | Magnetic slurry for highly efficient CMP | Yen-Ting Chen, Chun-Hao Kung, Tung-Kai Chen, Hui-Chi Huang | 2021-07-06 |
| 11043396 | Chemical mechanical polish slurry and method of manufacture | Chun-Hao Kung, Tung-Kai Chen, Chih-Chieh Chang, Kao-Feng Liao, Hui-Chi Huang | 2021-06-22 |
| 11037799 | Metal heterojunction structure with capping metal layer | Yi-Sheng Lin, Chi-Jen Liu, Liang-Guang Chen, Te-Ming Kung, William Weilun Hong +4 more | 2021-06-15 |
| 11024540 | Fin field-effect transistor device and method of forming the same | Shich-Chang Suen, Liang-Guang Chen | 2021-06-01 |
| 10967478 | Chemical mechanical polishing apparatus and method | Shich-Chang Suen, Liang-Guang Chen | 2021-04-06 |
| 10953514 | Chemical mechanical polishing apparatus and method | Shang-Yu Wang, Chun-Hao Kung, Ching-Hsiang Tsai, Hui-Chi Huang | 2021-03-23 |
| 10957587 | Structure and formation method of semiconductor device with conductive feature | Li-Chieh Wu, Kuo-Hsiu Wei, Tang-Kuei Chang, Chia Hsuan Lee, Jian-Ci Lin | 2021-03-23 |
| 10947414 | Compositions for use in chemical mechanical polishing | Fang-I Chih, Chih-Chieh Chang, Hui-Chi Huang | 2021-03-16 |
| 10950710 | Fin-type field effect transistor | Chun Hsiung Tsai | 2021-03-16 |
| 10943822 | Forming gate line-end of semiconductor structures | Che-Liang Chung, Che-Hao Tu, Chih-Wen Liu, You-Shiang Lin, Yi-Ching Liang | 2021-03-09 |
| 10937906 | Semiconductor device including fin structures and manufacturing method thereof | Chun Hsiung Tsai | 2021-03-02 |
| 10937691 | Methods of forming an abrasive slurry and methods for chemical-mechanical polishing | Chia Hsuan Lee, Chun-Wei Hsu, Chia-Wei Ho, Chi-Hsiang Shen, Li-Chieh Wu +6 more | 2021-03-02 |
| 10923355 | Methods and systems for dopant activation using microwave radiation | Chun Hsiung Tsai, Huai-Tei Yang, Kuo-Feng Yu | 2021-02-16 |
| 10916481 | Thickness sensor for conductive features | Chih-Hung Chen, Ying-Lang Wang | 2021-02-09 |