Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189497 | Chemical mechanical planarization using nano-abrasive slurry | Po-Chin Nien, Gang Huang | 2021-11-30 |
| 11133247 | Vias with metal caps for underlying conductive lines | Chia-Wei Ho, Chun-Wei Hsu, Chi-Hsiang Shen, Chi-Jen Liu, Yi-Sheng Lin +3 more | 2021-09-28 |
| 11094555 | CMP slurry and CMP method | Chun-Wei Hsu, Chi-Jen Liu, Kei-Wei Chen, Liang-Guang Chen, Chi-Hsiang Shen +2 more | 2021-08-17 |
| 11069533 | CMP system and method of use | Te-Chien Hou, Yu-Ting Yen, Cheng-Yu Kuo, Chih-Hung Chen, Kei-Wei Chen | 2021-07-20 |
| 11037799 | Metal heterojunction structure with capping metal layer | Yi-Sheng Lin, Chi-Jen Liu, Kei-Wei Chen, Liang-Guang Chen, Te-Ming Kung +4 more | 2021-06-15 |
| 10971370 | Hard mask removal method | Che-Hao Tu, Ying-Tsung Chen | 2021-04-06 |