Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133247 | Vias with metal caps for underlying conductive lines | Chia-Wei Ho, Chun-Wei Hsu, Chi-Hsiang Shen, Chi-Jen Liu, Yi-Sheng Lin +3 more | 2021-09-28 |
| 11121028 | Semiconductor devices formed using multiple planarization processes | Chun-Wei Hsu, Ling-Fu Nieh, Pinlei Edmund Chu, Chi-Jen Liu, Yi-Sheng Lin +2 more | 2021-09-14 |
| 11117239 | Chemical mechanical polishing composition and method | Shich-Chang Suen, Kei-Wei Chen | 2021-09-14 |
| 11114339 | Method for reducing metal plug corrosion and device | Ling-Fu Nieh, Chun-Wei Hsu, Pinlei Edmund Chu, Chi-Jen Liu, Yi-Sheng Lin | 2021-09-07 |
| 11094555 | CMP slurry and CMP method | Chun-Wei Hsu, Chi-Jen Liu, Kei-Wei Chen, William Weilun Hong, Chi-Hsiang Shen +2 more | 2021-08-17 |
| 11037799 | Metal heterojunction structure with capping metal layer | Yi-Sheng Lin, Chi-Jen Liu, Kei-Wei Chen, Te-Ming Kung, William Weilun Hong +4 more | 2021-06-15 |
| 11024540 | Fin field-effect transistor device and method of forming the same | Shich-Chang Suen, Kei-Wei Chen | 2021-06-01 |
| 10967478 | Chemical mechanical polishing apparatus and method | Shich-Chang Suen, Kei-Wei Chen | 2021-04-06 |
| 10961487 | Semiconductor device cleaning solution, method of use, and method of manufacture | Pinlei Edmund Chu, Chun-Wei Hsu, Ling-Fu Nieh, Chi-Jen Liu, Yi-Sheng Lin | 2021-03-30 |
| 10937691 | Methods of forming an abrasive slurry and methods for chemical-mechanical polishing | Chia Hsuan Lee, Chun-Wei Hsu, Chia-Wei Ho, Chi-Hsiang Shen, Li-Chieh Wu +6 more | 2021-03-02 |