Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211289 | Metal loss prevention using implantation | Tang-Kuei Chang, Kuo-Hsiu Wei, Kei-Wei Chen, Ying-Lang Wang, Su-Hao Liu +5 more | 2021-12-28 |
| 10957587 | Structure and formation method of semiconductor device with conductive feature | Kuo-Hsiu Wei, Kei-Wei Chen, Tang-Kuei Chang, Chia Hsuan Lee, Jian-Ci Lin | 2021-03-23 |
| 10937691 | Methods of forming an abrasive slurry and methods for chemical-mechanical polishing | Chia Hsuan Lee, Chun-Wei Hsu, Chia-Wei Ho, Chi-Hsiang Shen, Jian-Ci Lin +6 more | 2021-03-02 |
| 10916473 | Method of cleaning wafer after CMP | Chien-Hao Chung, Chang-Sheng Lin, Kuo-Feng Huang, Chun-Chieh Lin | 2021-02-09 |