Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011385 | CMP-friendly coatings for planar recessing or removing of variable-height layers | Wen-Kuei Liu, Teng-Chun Tsai, Kuo-Yin Lin, Shen-Nan Lee, Yu-Wei Chou +3 more | 2021-05-18 |
| 10916473 | Method of cleaning wafer after CMP | Chien-Hao Chung, Kuo-Feng Huang, Li-Chieh Wu, Chun-Chieh Lin | 2021-02-09 |