Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11120995 | Method for forming multi-layer mask | Chung-Wei Hsu, Yu-Chung Su, Chen-Hao Wu, Tsung-Ling Tsai, Teng-Chun Tsai | 2021-09-14 |
| 11031391 | Method for manufacturing a FinFET device | Kuo-Yin Lin, Pin-Chuan Su, Teng-Chun Tsai | 2021-06-08 |
| 11011385 | CMP-friendly coatings for planar recessing or removing of variable-height layers | Wen-Kuei Liu, Teng-Chun Tsai, Kuo-Yin Lin, Yu-Wei Chou, Kuo-Cheng Lien +3 more | 2021-05-18 |
| 11004794 | Partial barrier free vias for cobalt-based interconnects and methods of fabrication thereof | Tsung-Ling Tsai, Mrunal A. Khaderbad, Chung-Wei Hsu, Chen-Hao Wu, Teng-Chun Tsai | 2021-05-11 |
| 11004691 | Mechanism for manufacturing semiconductor device | Chen-Hao Wu, Chung-Wei Hsu, Tsung-Ling Tsai, Teng-Chun Tsai | 2021-05-11 |
| 10964549 | Wafer polishing with separated chemical reaction and mechanical polishing | Teng-Chun Tsai, Chu-An Lee, Chen-Hao Wu, Chun-Hung Liao, Huang-Lin Chao | 2021-03-30 |
| 10920105 | Materials and methods for chemical mechanical polishing of ruthenium-containing materials | An-Hsuan Lee, Chen-Hao Wu, Chun-Hung Liao, Teng-Chun Tsai, Huang-Lin Chao | 2021-02-16 |