Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11120995 | Method for forming multi-layer mask | Chung-Wei Hsu, Yu-Chung Su, Shen-Nan Lee, Tsung-Ling Tsai, Teng-Chun Tsai | 2021-09-14 |
| 11004691 | Mechanism for manufacturing semiconductor device | Shen-Nan Lee, Chung-Wei Hsu, Tsung-Ling Tsai, Teng-Chun Tsai | 2021-05-11 |
| 11004794 | Partial barrier free vias for cobalt-based interconnects and methods of fabrication thereof | Tsung-Ling Tsai, Shen-Nan Lee, Mrunal A. Khaderbad, Chung-Wei Hsu, Teng-Chun Tsai | 2021-05-11 |
| 10998239 | Fin isolation structure for FinFET and method of forming the same | Chu-An Lee, Peng-Chung Jangjian, Chun-Wen Hsiao, Teng-Chun Tsai, Huang-Lin Chao | 2021-05-04 |
| 10964549 | Wafer polishing with separated chemical reaction and mechanical polishing | Shen-Nan Lee, Teng-Chun Tsai, Chu-An Lee, Chun-Hung Liao, Huang-Lin Chao | 2021-03-30 |
| 10920105 | Materials and methods for chemical mechanical polishing of ruthenium-containing materials | An-Hsuan Lee, Shen-Nan Lee, Chun-Hung Liao, Teng-Chun Tsai, Huang-Lin Chao | 2021-02-16 |