Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069570 | Method for forming an interconnect structure | — | 2021-07-20 |
| 11011385 | CMP-friendly coatings for planar recessing or removing of variable-height layers | Teng-Chun Tsai, Kuo-Yin Lin, Shen-Nan Lee, Yu-Wei Chou, Kuo-Cheng Lien +3 more | 2021-05-18 |