Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10957587 | Structure and formation method of semiconductor device with conductive feature | Li-Chieh Wu, Kuo-Hsiu Wei, Kei-Wei Chen, Tang-Kuei Chang, Chia Hsuan Lee | 2021-03-23 |
| 10937691 | Methods of forming an abrasive slurry and methods for chemical-mechanical polishing | Chia Hsuan Lee, Chun-Wei Hsu, Chia-Wei Ho, Chi-Hsiang Shen, Li-Chieh Wu +6 more | 2021-03-02 |