Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133247 | Vias with metal caps for underlying conductive lines | Chun-Wei Hsu, Chi-Hsiang Shen, Chi-Jen Liu, Yi-Sheng Lin, Yang-Chun Cheng +3 more | 2021-09-28 |
| 11121028 | Semiconductor devices formed using multiple planarization processes | Chun-Wei Hsu, Ling-Fu Nieh, Pinlei Edmund Chu, Chi-Jen Liu, Yi-Sheng Lin +2 more | 2021-09-14 |
| 11094555 | CMP slurry and CMP method | Chun-Wei Hsu, Chi-Jen Liu, Kei-Wei Chen, Liang-Guang Chen, William Weilun Hong +2 more | 2021-08-17 |
| 11037799 | Metal heterojunction structure with capping metal layer | Yi-Sheng Lin, Chi-Jen Liu, Kei-Wei Chen, Liang-Guang Chen, Te-Ming Kung +4 more | 2021-06-15 |
| 10937691 | Methods of forming an abrasive slurry and methods for chemical-mechanical polishing | Chia Hsuan Lee, Chun-Wei Hsu, Chi-Hsiang Shen, Li-Chieh Wu, Jian-Ci Lin +6 more | 2021-03-02 |