Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145760 | Structure having improved fin critical dimension control | Kuan-Jung Chen, Chih-Mu Huang, Ching-Pin Lin, Sheng-Lin Hsieh | 2021-10-12 |
| 11011566 | Bonding pad on a back side illuminated image sensor | Volume Chien, Hsin-Chi Chen, Hung-Ta Huang, Ying-Hao Chen, Ying-Lang Wang | 2021-05-18 |
| 10903336 | Semiconductor device and method of manufacturing the same | Ru-Shang Hsiao, Ching-Pin Lin, Chih-Mu Huang, Fu-Tsun Tsai | 2021-01-26 |