Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171172 | Image sensor and method of forming the same | Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee | 2021-11-09 |
| 11171199 | Metal-insulator-metal capacitors with high breakdown voltage | Wei-Ting Chen, Tsung-Han Tsai, Kun-Tsang Chuang, Po-Jen Wang, Chien-Cheng Huang | 2021-11-09 |
| 11011566 | Bonding pad on a back side illuminated image sensor | Volume Chien, I-Chih Chen, Hsin-Chi Chen, Hung-Ta Huang, Ying-Lang Wang | 2021-05-18 |
| 10985199 | Image sensor having stress releasing structure and method of forming same | Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee, Chun-Wei CHIA | 2021-04-20 |