Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201082 | Deep trench isolation structure in semiconductor device | Yu-Hua Yen, Ching-Hung Kao, Tsung-Han Tsai | 2021-12-14 |
| 11171199 | Metal-insulator-metal capacitors with high breakdown voltage | Wei-Ting Chen, Tsung-Han Tsai, Kun-Tsang Chuang, Ying-Hao Chen, Chien-Cheng Huang | 2021-11-09 |
| 10916416 | Semiconductor wafer with modified surface and fabrication method thereof | Yao-Wen Hsu, Ching-Hung Kao, Tsung-Han Tsai | 2021-02-09 |