Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11201082 | Deep trench isolation structure in semiconductor device | Yu-Hua Yen, Po-Jen Wang, Tsung-Han Tsai | 2021-12-14 | $17,774,000 |
| 10916416 | Semiconductor wafer with modified surface and fabrication method thereof | Yao-Wen Hsu, Po-Jen Wang, Tsung-Han Tsai | 2021-02-09 | $47,047,000 |