Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11053602 | Micro-roughened electrodeposited copper foil and copper foil substrate | Yun-Hsing Sung | 2021-07-06 |
| 11047061 | Micro-roughened electrodeposited copper foil and copper foil substrate | Yun-Hsing Sung, Zong-Xian Wu | 2021-06-29 |