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Home › 2021 › Co-Tech Development › Chun-Yu Kao
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Chun-Yu Kao — 2 Patents in 2021

CDCo-Tech Development: 2 patents #2 of 3Top 70%
Hsinchu, TW: #678 of 2,737 inventorsTop 25%
Overall (2021): #173,262 of 548,734Top 35%
2 Patents 2021

Issued Patents 2021

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11053602 Micro-roughened electrodeposited copper foil and copper foil substrate Yun-Hsing Sung 2021-07-06
11047061 Micro-roughened electrodeposited copper foil and copper foil substrate Yun-Hsing Sung, Zong-Xian Wu 2021-06-29

Nearby-Ranked Inventors

Chittaranjan Kashiwar2
Christopher K. Karstens2
Chetan Shantilal Karani2
Chen-Kuan Kao2
Cheng-Yu Kao2
Chin-Li KAO2
Chien-Teh Kao2
Chih-Chieh Kao2
Chuan-Yen Kao2