Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11186918 | Micro-roughened electrodeposited copper foil and copper clad laminate using the same | — | 2021-11-30 |
| 11053602 | Micro-roughened electrodeposited copper foil and copper foil substrate | Chun-Yu Kao | 2021-07-06 |
| 11047061 | Micro-roughened electrodeposited copper foil and copper foil substrate | Chun-Yu Kao, Zong-Xian Wu | 2021-06-29 |