Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11047061 | Micro-roughened electrodeposited copper foil and copper foil substrate | Yun-Hsing Sung, Chun-Yu Kao | 2021-06-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11047061 | Micro-roughened electrodeposited copper foil and copper foil substrate | Yun-Hsing Sung, Chun-Yu Kao | 2021-06-29 |