Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127650 | Semiconductor device package including thermal dissipation element and method of manufacturing the same | Chien Lin CHANG CHIEN, Chiu-Wen LEE, Hung-Jung Tu, Chang-Chi Lee | 2021-09-21 |
| 11011444 | Semiconductor package structure | Ya-Yu Hsieh, Chung-Hsuan Tsai, Chia-Pin Chen | 2021-05-18 |