Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11011444 | Semiconductor package structure | Ya-Yu Hsieh, Chin-Li KAO, Chung-Hsuan Tsai | 2021-05-18 | $3,233,000 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11011444 | Semiconductor package structure | Ya-Yu Hsieh, Chin-Li KAO, Chung-Hsuan Tsai | 2021-05-18 | $3,233,000 |