Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201110 | Semiconductor device package with conductive pillars and method for manufacturing the same | Min-Lung Huang, Hsin Hsiang Wang | 2021-12-14 |
| 11189604 | Device assembly structure and method of manufacturing the same | Chao-Kai Hung, Chien-Wei Chang, Ya-Chen Shih, Hung-Yi Lin, Cheng-Yuan KUNG | 2021-11-30 |
| 11127650 | Semiconductor device package including thermal dissipation element and method of manufacturing the same | Chien Lin CHANG CHIEN, Chiu-Wen LEE, Chang-Chi Lee, Chin-Li KAO | 2021-09-21 |