Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211325 | Semiconductor device package and method for manufacturing the same | Wen-Hung Huang, Yan Wen CHUNG | 2021-12-28 |
| 11201110 | Semiconductor device package with conductive pillars and method for manufacturing the same | Hung-Jung Tu, Hsin Hsiang Wang | 2021-12-14 |
| 11107881 | Semiconductor package devices having conductive layer, semiconductor wall, conductive wall, and insulation layer | Shao Hsuan CHUANG, Huang-Hsien Chang, Yu-Cheng Chen, Syu-Tang Liu | 2021-08-31 |
| 11011491 | Semiconductor device packages and methods of manufacturing the same | Shun-Tsat TU, Pei-Jen Lo, Fong Ren Sie, Cheng-En Weng | 2021-05-18 |
| 10939561 | Wiring structure and method of manufacturing the same | Wen-Hung Huang | 2021-03-02 |